Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. It is commonly used for thin-film deposition, etching and analytical techniques. The incident ions set off collision cascades in the target.
When such cascades recoil and reach the target surface with an energy above the surface binding energy, an atom can be ejected. If the target is thin on an atomic scale the collision cascade can reach the back side of the target and atoms can escape the surface binding energy `in transmission’.
You might also like
|Physical Vapor Deposition (PVD) What is Physical vapour deposition ? Physical...||What is “Thin Films” materials ? Advanced Materials : Thin Films Thin film...||Cold Metal Spraying How Does Cold Spray Work ? In the ,...||How Does Chemical Vapour Deposition (CVD) Work ? Chemical Vapour Deposition (CVD) Chemical...|